AIRLINK 74.62 Increased By ▲ 0.33 (0.44%)
BOP 4.94 Decreased By ▼ -0.01 (-0.2%)
CNERGY 4.36 Decreased By ▼ -0.01 (-0.23%)
DFML 39.00 Increased By ▲ 0.20 (0.52%)
DGKC 85.29 Increased By ▲ 0.47 (0.55%)
FCCL 21.10 Decreased By ▼ -0.11 (-0.52%)
FFBL 34.15 Increased By ▲ 0.03 (0.09%)
FFL 9.65 Decreased By ▼ -0.05 (-0.52%)
GGL 10.45 Increased By ▲ 0.03 (0.29%)
HBL 113.50 Increased By ▲ 0.50 (0.44%)
HUBC 136.50 Increased By ▲ 0.30 (0.22%)
HUMNL 11.56 Decreased By ▼ -0.34 (-2.86%)
KEL 4.73 Increased By ▲ 0.02 (0.42%)
KOSM 4.45 Increased By ▲ 0.01 (0.23%)
MLCF 37.70 Increased By ▲ 0.05 (0.13%)
OGDC 139.00 Increased By ▲ 2.80 (2.06%)
PAEL 25.35 Increased By ▲ 0.25 (1%)
PIAA 20.68 Increased By ▲ 1.44 (7.48%)
PIBTL 6.63 Decreased By ▼ -0.08 (-1.19%)
PPL 122.40 Increased By ▲ 0.30 (0.25%)
PRL 26.65 No Change ▼ 0.00 (0%)
PTC 14.05 Increased By ▲ 0.12 (0.86%)
SEARL 58.20 Increased By ▲ 0.98 (1.71%)
SNGP 67.23 Decreased By ▼ -0.37 (-0.55%)
SSGC 10.30 Increased By ▲ 0.05 (0.49%)
TELE 8.36 Decreased By ▼ -0.04 (-0.48%)
TPLP 11.14 Increased By ▲ 0.01 (0.09%)
TRG 63.34 Increased By ▲ 0.53 (0.84%)
UNITY 26.60 Increased By ▲ 0.10 (0.38%)
WTL 1.44 Increased By ▲ 0.09 (6.67%)
BR100 7,821 Increased By 11.1 (0.14%)
BR30 25,291 Increased By 141.3 (0.56%)
KSE100 75,048 Increased By 91.2 (0.12%)
KSE30 24,142 Increased By 59.1 (0.25%)

South Korea's Hynix Semiconductor Inc has held talks with Europe's biggest chip maker, ST-Microelectronics, to build a chip plant in China, Hynix said on Monday, for a reported cost of $1.73 billion.
Such a tie-up would give the companies access to a market growing at an average 20 percent a year and help Hynix escape hefty US and European tariffs on its products.
Hynix, the world's third-largest maker of memory chips, has long eyed an entry into China's $30 billion semiconductor market and analysts said an alliance appeared a good option for an indebted firm struggling to make profits.
"I view the alliance as a most likely deal following their agreement last year to jointly develop flash memory chips," said Chin Yeong-hoon, a Daishin Securities' analyst, referring to a tie-up between the two firms to co-operate in chip development.
"For Hynix, forming a joint venture must be better than going alone in terms of funding", added Chin.
The proposed plant would make DRAM (dynamic random access memory) chips used for computer memory and flash memory chips used in digital cameras and mobile phones, Hynix said.
"We are considering a variety of options and (partnership) with STMicroelectronics is one of them," said Park Hyun, a spokesman for Hynix. "We may team up with a foreign investor, but may push ahead with it on our own."

Copyright Reuters, 2004

Comments

Comments are closed.