SEOUL: Round-up of South Korean financial markets, South Korea's KOSPI stock index shed earlier losses on Monday. The Korean won barely moved, while bond yields rose.
At 0147 GMT, the KOSPI was up 3.50 points or 0.14 percent at 2,420.26. The benchmark index turned to positive territory as market heavyweight Samsung Electronics and SK Hynix made a rebound, after dropping nearly 2 percent in earlier trade.
Steelmakers are giving support as they rose ahead of a possible trade deal between Seoul and Washington. Dongbu Steel shares surged as much as 21.8 percent and Husteel shares jumped 7.3 percent, while Seah Steel rose 5.5 percent. The sub-index for iron, steel, and metal shares was up 2.2 percent.
The won was quoted at 1,081.6 per dollar on the onshore settlement platform, 0.06 percent firmer than its previous close at 1,082.2.
In offshore trading, the won was quoted at 1,081.3 per US dollar, up 0.14 percent from the previous day, while in one-year non-deliverable forwards, it was being transacted at 1,065.95 per dollar.
MSCI's broadest index of Asia-Pacific shares outside Japan was down 0.3 percent after US stocks ended the previous session with losses. Japanese stocks weakened 0.95 percent.
The KOSPI is down around 2.1 percent so far this year, and down by 1.49 percent in the previous 30 days.
The current price-to-earnings ratio is 12.10, the dividend yield is 1.28 percent and the market capitalisation is 1,242.04 trillion won.
The trading volume during the session on the KOSPI index was 145,764,000 shares, and of the total traded issues of 883, the number of advancing shares was 403.
Foreigners were net sellers of 85,333 million won worth of shares.
The U.S dollar has risen 1.4 percent against the won this year. The won's high for the year is 1,056.67 per dollar on Jan. 14, 2018, and low is 1,098.4 on Feb. 6, 2018.
The Korean 3-month Certificate of Deposit benchmark rate was quoted at 1.65 percent, while the benchmark 3-year Korean treasury bond yielded 2.227 percent, higher than the previous day's 2.22 percent.
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